Chip Packaging Issues reportedly affecting CPU Stock for most of 2021

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Even more bleak news is coming in for stock on processors.

While some may think that the same materials are used for every processor available in stores, that would be far from the truth.

From its boxes, to the transistors, the lead and wafer materials are all quantified and calculated depending on the specifications for different processors. Because of this, manufacturers have had to shift priority of materials to the new or popular CPUs.

With that, lets see what's been reported, and what may be affected for now.

Which Components Are Affected?

According to Tom's Hardware, the main components affected are:

  • Wirebonding Capacities
  • Lack of ABF Substrates
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Wirebonding is a series of connected methods that join up wires, semiconductors and much more onto processors and circuits. It forms a chip to a substrate, substrate to substrate, or substrate to a package.

ABF Substrates, or 'Ajinomoto Build-up Film' is a substrate that holds all the pins and wirebonding together.

READ MORE: Intel's Comet-Lake and Rocket Lake-S pricing revealed?

When can we expect some Normality?

Not to sound cliché, but industries and factories have not seen circumstances like this, especially for recent companies in semi-conductor technologies.

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Those with low materials are building out chips at a lower rate, around 65-70% of what would normally be created and sent out to stores.

Obviously this causes a knock-on effect for companies such as Intel, AMD and NVIDIA, but it doesn't mean that its a permanent situation.

With vaccination programmes now being carried out, it's only a matter of time, perhaps from July of this year, where we will see some situations return to some kind of normal, and in-turn, materials back to normal again.

READ MORE: TSMC to make 5nm CPU in 2022; what does it mean?